BGA Rework and inspection Real time viewing

Seeing takes the guesswork out of rework As the use of BGA’s, micro BGA’s, CSP’s and flip chips being incorporated onto the average board, grows, it becomes increasingly difficult for the process engineer to qualify his or her surface mount line. Automatic inspection systems, in circuit-test and X-ray equipment, are often employed to aid this process, but most engineers appreciate the value of true visual inspection, the ability to view those troublesome hidden solder joints lurking underneath BGA type components. Once faulty joints have been discovered, the problem is magnified, as engineers attempt to rework these delicate packages. Blundell Production Equipment and ERSA offers an unrivalled solution in the Ersascope inspection system and the IR/PL/RPC550 & 650 semi automatic rework stations. Although X-ray technology has traditionally been the solution to the problem of hidden solder joints, this type of equipment is expensive, can be problematic to operate and output sometimes difficult to interpret. Instead of looking through the CSP or BGA package, the Ersascope enables users to actually see underneath components via a patented optical instrument, which combines fibre optic high intensity light with up to 700x magnification. Due to it’s unique ability to see from ground level up, the new chip lens has a centre iris position set at less than 12 micron from ground. This is some 25 times lower than other lenses, allowing the operator to see up at the device substrate connection as well as down to the circuit board, on components such as CSP’s and flip-chip. It is possible therefore to inspect joints under advanced packages, using known criteria such as the joint shape, surface appearance and drop height. The software has further been improved to offer more information, more images and the ability to network to other users and published papers. Advanced measurement and image enhancement systems have also been incorporated into one of the three software options now available. Due to the massive expansion in use of the Ersascope over the last five years it has been possible to not only improve, but to cost reduce both hardware and software to a point where a BGA inspection Ersascope system can cost as little as £7k. The IR rework stations start as low as £7.5k and a complete system with split vision alignment and process control camera incorporating true closed loop heater control and real time viewing at over x60 magnification of reflow, will be less than £21k. The Ersascope and IR/PL rework package take the guesswork out of process control, inspection and repair. More importantly they offer a solution posed by the massively reduced process window required for lead-free. The Dark IR heaters of the rework systems produce an insignificant delta ‘T’ and have the power to ramp through to reflow at a constant and controlled rate to ensure perfect selective reflow every time. While the Ersascope can qualify the in-line process or fault find to component level it will also identify between tin lead or lead-free. It can highlight problems associated with such things as single drop, due to the reduced process window, potentially a very real problem for lead free. The risks of poorly reflowed solder joints are going to be heightened and the Ersascope and IR/PL suite will make the transition less painful and more cost effective. All in all, a package that the modern production unit can ill afford to be without and when backed by the reliability and innovation of ERSA and service support of Blundell this is truly a matchless combination.

For more information on BGA Rework and inspection Real time viewing talk to Blundell Production Equipment