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Superswash
Defluxing - removing soldering residues after reflow Cleaning contamination from handling and board manufacturing, removing FOD High density electronic assemblies with low standoff components like BGA, CSP, BTC, QFN, MELF, small chips Cleaning of power electronics Electronic assemblies requiring extra short process time Second side misprints on complex assemblies Cleaning before conformal coating and wire bonding High volume stencil cleaning For Ionic Testing see:- CT100 For the PBT website, click here
Please contact us for more information on our Superswash
Defluxing - removing soldering residues after reflow Cleaning contamination from handling and board manufacturing, removing FOD High density electronic assemblies with low standoff components like BGA, CSP, BTC, QFN, MELF, small chips Cleaning of power electronics Electronic assemblies requiring extra short process time Second side misprints on complex assemblies Cleaning before conformal coating and wire bonding High volume stencil cleaning For Ionic Testing see:- CT100 For the PBT website, click here
Please contact us for more information on our Superswash
For more information on Superswash talk to Blundell Production Equipment
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