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Clay-Bond Plus allows you to create a permanent bond between fired metal clay pieces, along with sterling silver, fine silver and Argentium findings, without the use of solder and without torch firing. Clay-Bond Plus is supplied in a metal alloy powder form, which becomes a paste when mixed with water. When fired in a kiln, the paste sets into a permanent metal-based adhesive, as an alternative to traditional torch soldering. Ensure the areas to be joined are flat and clean (use emery paper and sand to show bright metal). To apply Clay-Bond Plus, use a brush with short, stiff bristles and apply paste to both metal pieces. Join the pieces together as desired, and leave to dry for a few minutes. The binding agent will dry, leaving a hold which will not shift or separate before or during the firing process, although care should be taken when handling the metal before firing. When using Clay-Bond Plus with metal clay, arrange the joined pieces in a small sized firing pan, embedded in activated carbon. Each jar contains 5g of powder. Please note that Clay-Bond Plus is not suitable for use on unfired metal clay items. Metal clay items must be fired as normal before using Clay-Bond Plus.
For more information on Clay Bond Plus 5g, please contact us on 0345 100 1122.
For more information on Clay Bond Plus 5g talk to Cooksongold