Solder Plus Dispensing Paste

When joints are needed but printing is not possible, Nordson EFD’s premium dispensing solder paste supports a wider array of applications with formulations created for specific uses. In addition to the standard pastes offered by other suppliers, EFD provides specialized formulations for low-temperature and high-temperature reflow and leaded and lead-free alloys in all flux types and alloy particle sizes. To help customers find the right solder paste, our formulations are available in different categories called “families.” Each family contains the characteristics needed to produce optimal results in specific applications. SolderPlus® Families •Clear residue •Difficult-to-solder surfaces •Enhanced wetting •Extended reflow cycle times (> 6 min.) •Fine pitch •Gap filling and/or vertical surfaces •General purpose •Halide-free •Lead-free shiny fillet •Low residue •Pin transfer or dipping (low viscosity) •Rapid reflow cycle time (< 5 sec.) •Reduced slump •Restricted residue •UV-traceable

For more information on Solder Plus Dispensing Paste talk to Nordson EFD