Multi Chip Module

Embedded Component Technology (ECT) is supported within the Pulsonix Design environment. This powerful option enables true embedding technology with buried and printed resistors capacitors with dielectric layers and multi-layer planar transformers. Advanced microvias using laser technology stacked and staggered are supported as are hybrid designs and build-up technologies. Flexi-rigid PCBs are fully supported where the the flex PCB allows SM components on both sides of the exposed flex.

For more information on Multi Chip Module talk to Pulsonix