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Effective Assembly Techniques For COB
The Chip-On-Board option provides features for creation and annotation of die & bond pads and bond wires. It also allows automatic placing bond pads around the die. Within the Pulsonix design the bond pads are treated as special pads and can move independently of die and normal pads.
The Chip-On-Board option provides features for creation and annotation of die & bond pads and bond wires. It also allows automatic placing bond pads around the die. Within the Pulsonix design the bond pads are treated as special pads and can move independently of die and normal pads.
For more information on Effective Assembly Techniques For COB talk to Pulsonix
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