Qualitek Delta 788 WS Solder Paste

Print Bricks Every Time 788 water-soluble solder paste is highly slump resistant. This formulation has enhanced printing characteristics and is non-hygroscopic (moisture resistant) which will not degradate in dry and humid climates. Superior flux activity will eliminate voiding and solderability issues with fine pitch and Micro BGA components. Robust profile window ensures drop in to most water soluble processes. Also Available in -400+635 Mesh particle size for < 16 mil fine pitch printing. 100% water soluble and will wash easily with warm deionized water. Compatible with lead free processes. Available in Jars, syringes, cartridges and DEK Proflow tested and approved.

For more information on Qualitek Delta 788 WS Solder Paste talk to Qualitek Europe Ltd