Qualitek's LF217 Lead Free Solder Paste

LF217 Lead Free Solder Paste alloy composition Sn95.5/Ag4.0/Cu0.5. LF217 is designed as a lead free alternative for Sn/Pb alloys in electronics assembly operations. These series of pastes were specifically formulated to provide activity levels similar to Sn/Pb formulations. Although LF217 requires higher temperatures, these pastes do not exhibit thermal degradation. In the search for lead free alternatives, the electronics industry has selected an alloy consisting of Tin, Silver and Copper. Qualitek has developed flux systems in combination with these alloy system, which exhibits superior joint strength and excellent wettability. Qualitek has addressed the main challenge of lead free soldering by providing robust formulations with the least effect on current processes. LF217 is an available alloy for Delta Elite 691 No-Clean Solder Paste and 788 Water-Soluble Solder Paste. Benefits:- Enhanced Printing- Excellent wetting on OSP- Extended stencil & tack time- Air or nitrogen reflow- Pin Probable formulations.

For more information on Qualitek's LF217 Lead Free Solder Paste talk to Qualitek Europe Ltd