myOPALE

Remote Embedded Modular Computers myOPALE from ECRIN Systems provides a simple solution for applications that need more I/O boards than can be fitted in a standard Industrial PC based on backplane PCB. myOPALE concept is based on four major principles: Remove mechanical link between CPU and I/O cards thanks to PCI Express Over Cable interconnection; Building blocks in a standard 5.25?? form factor; Re-Use of widely deployed interconnect standards from SNIA/SFF Technology Affiliate that encompass cables, connectors, form factor sizes and housing dimensions; Thermal solution at building blocks level. The CPU module incorporates all the features of an embedded computer into a small form factor 5.25?? site with less than 8" depth. The design is based on COM Express Type 6 and integrates Embedded Low Power SKU?s with 10 years life support. In Skylake and Kaby Lake versions, Intel Core i7 or Xeon E3-1500 CPU with Chipset platforms are selected, which directly drive 24 PCIe Gen3 lanes as their expansion bus.

For more information on myOPALE talk to Sarsen Technology Ltd