Quick 861DA Hot Air Rework Station

The Quick 861DA hot air rework station has been designed for de-soldering SMD components such as small outline integrated circuits (SOIC), integrated circuits (IC), quad flat packs (QFP), plastic leaded chip carriers (PLCC) and ball grid arrays (BGA), but can also be used for any production application requiring controlled hot air such as heat shrinking, lacquer removal and preheating. This digitally controlled system has a lot of great features such as three programmable channels for independant temperature and air flow settings, an automatic sleep state, password protection and automatic cooling system.

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