Tin Bismuth Low Temperature Solder Paste Jars

The Qualitek 670 tin bismuth solder paste has been developed for low-temperature soldering. With a melting point of 138°C and a peak reflow temperature of approximately 173°C, the 670 tin bismuth paste is suitable for soldering temperature-sensitive surface mount components. The 670 is a no-clean solder paste.

For more information on Tin Bismuth Low Temperature Solder Paste Jars talk to Somerset Solders