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Plastic Molded Packages for QFN
Plastic Molded Packages for QFN

Our European Packaging line, located in Toulouse, allows us to deliver fast-run prototypes or small series in following packages :Plastic moulded : QFN?s, SOIC, QFP?s, DIP?s Air cavity / Premoulded plastic : QFN?s, SOIC?s, QFP?s, DIP?s ? Ceramics (ceramic or metal lid) ? Metal packages : TO?s ? Organic packages: BGA, LGA An investment plan is on-going to drive this line towards mid-series for plastic package. This should be effective by Q2 2019. Larger series as to offer large portfolio and competitive prices are handled through our Top3 OSAT partnership. This allows us to offer a wide spectrum of standard and custom packaging solutions, including wafer bumping.

For more information on Plastic Molded Packages for QFN talk to Synergie-Cad (UK) Ltd

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