Printed Circuit Board Fabrication

All boards fabricated by specialized in-house PCB facility Processes tailored for test board needs CIC technology used for improved flatness, strength and temperature performance * Up to 40 multi-layers * Thickness : Up to 6.5mm * Maximum Board Size : 750mm x 580mm * Improved Planarity through CIC Technology * Dry Film Exposure - Clean Room rated 1.000 * Laser Direct Imaging * Blind and buried via * Laser Drilling * Minimum hole diameter 0.075mm * Impedance Control

For more information on Printed Circuit Board Fabrication talk to Synergie-Cad (UK) Ltd