Telso Splice TS3 assembly board

The TelsoSplice TS3 is a well-proven and sophisticated wire splicing system. Thanks to its strong design, it is capable of splicing from 0.26 up to 40 mm? cross section. Because of the lightweight and compact design, it is ideal for use as a portable unit on wire harness assembly boards.

For more information on Telso Splice TS3 assembly board talk to Telsonic Ultrasonics