Wire Saw

A Wire Saw can cut the same variety of materials as the Low Speed Diamond Wheel Saw yet has the advantage of cutting with a gentler lapping action. The Wire Saws can be used with an abrasive slurry or with a diamond wire and can easily cut brittle samples that would normally chip or crack when cut on a Diamond Wheel Saw. The Wire Saw can often reduce post cut polishing and is ideal when little or no subsurface damage can be tolerated. Applications for Wire Saws range from wafering and dicing ceramics and semiconductor materials to opening electronic packages for failure analysis.

For more information on Wire Saw talk to Testbourne Ltd