Trackwise Improved Harness Technology™ achieves major milestone

Trackwise is pleased to announce the successful completion of a major milestone in the development of Improved Harness Technology™ - the manufacture of a 10metre/30foot 6 layer flexible multilayer PCB. Philip Johnston, Trackwise Managing Director, commented “We are delighted with the results of recent trials. Whether or not this is the largest multilayer printed circuit ever manufactured – the next phase will see Trackwise manufacture a 25metre/80foot multilayer PCB – this is clear demonstration of the core offering of Improved Harness Technology™ - length-unlimited multilayer printed circuits to replace conventional wire harness or EWIS.” Improved Harness Technology™ is a patented, proprietary technology that brings, for the first time, the proven benefits of flexible printed circuits – weight saving, space saving, improved precision, improved reliability – to system level applications. Trackwise is pleased to acknowledge the financial contribution of Innovate UK and the Aerospace Technology Institute (ATI) to this project.

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