TSB Liquid Thermal Shock

Purchasing a liquid thermal shock chamber needs close consideration of the long term operating costs. The specialized liquids used can easily evaporate, causing the loss of thousands of dollars of fluid per year, if not properly contained. Liquid-to-liquid thermal shock testing is typically conducted to apply very strong, repetitive thermal stress to test pieces. It can model a product's ability to withstand thermally-induced size changes, crack resistance, hermetic integrity, and changes in electrical properties. This form of testing provides a very rapid temperature shock recovery of conditions, and it can significantly reduce testing time by requiring shorter soaks and less cycles. The TSB thermal shock chambers have been built to meet the demanding test requirements of Mil-Std 883 method 1011.9, which has become a defacto industrial standard for semiconductor devices.

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