

Heraeus Electronics will highlight its latest advancements in high-reliability materials for power electronics through a series of live presentations at PCIM Europe 2025, scheduled to take place May 6-8, 2025 in Nuremberg, Germany. Visitors can explore Heraeus Electronics’ wide range of material solutions at Hall 6, Booth 6-310.
Among the highlights at PCIM will be the debut of DTS® Silver, a next-generation Die Top System material designed for high-performance applications at an optimized cost. The Heraeus Die Top System (DTS®) enables copper wire on sintered power semiconductors, delivering exceptional flexibility. DTS® enhances electrical and thermal conductivity, strengthens die connection reliability, and optimizes overall module performance. The innovative solution DTS® Silver is free of palladium and gold, offering a cost-efficient yet highly reliable alternative for power electronics manufacturers.
Substrate layout courtesy of Fraunhofer IISB
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Heraeus Electronics will also showcase Condura®.ultra, a silver-free AMB bonding technology for metal-ceramic substrates. Designed for high-end applications and with a low total cost of ownership Condura®.ultra maintains outstanding reliability. Condura®.ultra enables the use of thicker copper layers while allowing thinner ceramics, maintaining equal thermal resistance compared to traditional AlN substrates. With high thermal conductivity (>80 W/m∙K), this innovative material is ideal for sintering, bonding, and soldering processes, offering exceptional performance.
Experts from Heraeus will deliver two insightful presentations at the e-Mobility & Energy Storage Stage (Hall 6, Booth 220), providing in-depth insights into cutting-edge materials for power electronics:
- “Heraeus Electronics Introduces the Next Generation DTS®”
- Speaker: Christian Kersting
- Date & Time: May 6, 12:30 PM
- “Ag-Free Silicon Nitride AMB Substrates for Automotive Power Module Applications”
- Speaker: Oliver Mathieu
- Date & Time: May 7, 12:55 PM
Heraeus Electronics will also host several live product presentations at its booth, showcasing the latest advancements in power electronics materials:
- DTS® Silver – The innovative solution for cost-optimized, high-performance applications
- Live Presentation: May 7th, 14:00 PM and May 8th, 11:00 PM
- Condura®.ultra – A cost-effective, silver-free Silicon Nitride AMB for demanding applications
- Live Presentation: May 6th, 11:00 PM and May 8th, 13:00 PM
- mAgic PE360 – Pressure silver sinter paste for module attach applications
- Live Presentation: May 6th, 14:00 PM
- Fastlane – An EU-funded project accelerating the European value chain for power electronics
- Live Presentation: May 7th, 14:00 PM and May 8th, 11:00 PM
Heraeus Electronics invites attendees to visit Hall 6, Booth 6-310 to experience these solutions and more firsthand and engage with technical experts.
For more information on Heraeus Electronics to Debut New Die Top System Material with Insightful Live Presentations at PCIM Europe 2025 talk to Whats New in Electronics (WNIE)