6 critical factors to consider when potting an electronic assembly

Potting is the process of filling or submersing a complete electronic assembly using a compound material. Original equipment manufacturers (OEMs) may want their assemblies potted for a number of reasons, but typically it is carried out to protect against shock and vibration, or to stop moisture or corrosive agents from getting near the electronics. While the process may sound quite simple - just a case of pouring liquid resin into an enclosure - it can actually be a real challenge for those carrying it out. To achieve the "perfect pot", there are a number of factors to take into consideration, to ensure that the dispensed potting material is consistent and repeatable. In this blog post, we will look at six steps that must be followed, in order achieve a consistent result. We have also listed a number of hints and tips for those involved in carrying out the process within electronics manufacturing.

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