Here at Inseto we are one of the leading technical distributors of equipment and related materials to the microelectronic and advanced technology sectors we also provide technical and adhesives for electronics to the automotive and industrial manufacturing industries. The company was established in 1987 and ISO 9001:2015 certified since 2005. Here at Inseto we pride ourselves on forging long-term relationships with out principals and in obtaining mutual respect from, our customers. Inseto’s are located one-hour of west London. We operate from a state-of-the-art facility that house our administration team, Goods Storage & Distribution, Adhesives Application Laboratory, Demonstration, Repair & Training Facilities. Our range of advanced equipment and materials are available from specialist technology divisions, we offer carefully selected, technically innovative, high performance products, including: Equipment Division - Provides manufacturing equipment for the Microelectronic, Photonic, Electronic, Photovoltaic and Semiconductor industries etc. Consumable Division - Provides assembly materials and machine consumable items for the Semiconductor, Electronic, Microelectronic, Photonic MEMS and Hybrid assembly industries etc. Adhesive Division - Provides technically advanced adhesives for bonding, sealing & encapsulation, exclusively representing DELO Industrial Adhesives in the UK & Ireland. At the Inseto adhesive division we provide technically advanced adhesives and equipment for bonding, sealing, and encapsulations. Including UV cured acrylates, light activated epoxies, dual heat and light or moisture cured materials, anaerobic curing adhesives, single part silicones, cyanoacrylates, structural polyurethanes and one or two part epoxies. At our Inseto equipment division we are a leading supplier of assembly, test and inspection equipment including semiconductor furnaces, lithography equipment, probing systems, wafer dicers and scribers, die attach and wire bonding machines, plasma etching and cleaning systems, vacuum solder reflow ovens, wire bond and materials testing equipment in the UK, Ireland and Nordic regions. At the Inseto’s consumable Division we provide production materials and tools used in the manufacturing of microelectronic and related devices, including bonding & welding wires-ribbons, precision stampings, solder preforms, hermetic packages, thin film substrates, thick film & thermal dissipation materials, welding electrodes and thermodes, bonding tools, capillaries and dicing blades etc.