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![Ceramic sealed packages](https://images.findtheneedle.co.uk/findtheneedle/products/3304488.jpg)
Multi-Layer Co-Fired Ceramic Packages, Single Chip and Multi Chip Housing and Substrates for low and medium volume applications. Capabilities include Pins, Seal-Frames & Packages as large as four inches square and between 2 and 30 layers of circuitry.
For more information on Ceramic sealed packages talk to Inseto (UK) Ltd
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