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![Die Attach Systems (Component Pick and Place Equipment)](https://images.findtheneedle.co.uk/findtheneedle/products/3425517.jpg)
Tresky AG designs and manufactures bench top manual to fully automatic equipment for: Die Bonding, Chip Attach, Hybrid Assembly, SMT, MCM, COB, Flip-Chip, Microsystems, Optoelectronic, and many more.
For more information on Die Attach Systems (Component Pick and Place Equipment) talk to Inseto (UK) Ltd
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