Kulicke & Soffa (K&S) Wire Bonders & Die Bonding Equipment

Kulicke & Soffa are the world leaders for manual and semi-automatic, bench mounted wire bonders. The KnS gold wire bonders, copper stud bump / wire & aluminium ultrasonic bonding systems are very easy to operate and are ideal for universities, development laboratories through to medium volume production facilities. These systems provide higher productivity and yields, whilst enabling production of the most complex packages at the lowest cost. K&S also produce a range of fully automatic ball bonders for high speed IC & MCM assembly, flexible large area hybrid markets and stud bumpers for up to 12" wafers, as well as automatic die bonding systems.

For more information on Kulicke & Soffa (K&S) Wire Bonders & Die Bonding Equipment talk to Inseto (UK) Ltd