Laser Scribing Systems

With ever-increasing transistor density, shrinking metal lines and gate dimensions, producers are forced to use metals of higher conductivity such as copper, "low-k" isolation materials such as "black diamond" and more test pads. These new manufacturing standards set a different threshold for wafer singulation whereby traditional step cut dicing no longer meets the quality requirements and cost targets for manufacturing. ADT meets the market challenge with a new, revolutionary type of laser for wafer scribing. The nextstep System only removes silicon leaving the wafer bare and as good as new.

For more information on Laser Scribing Systems talk to Inseto (UK) Ltd