MA6 Mask Aligner for Pieces, Small Substrates and Wafers up to 150mm

MA6 Mask Aligner for Pieces, Small Substrates and Wafers up to 150mm The compact, easy to use MA6 is a manually loaded system that sets the benchmark in semiconductor submicron research and microsystems production. It is available in three different models, dependent upon the customers applications and requirements. Features and capabilities include: - Processing of fragile, warped or part wafers and pieces from a few millimetres up to 150mm - Top side, bottom side & infrared alignment capabilities - UV250/300/400 Diffraction-reducing exposure optics with fast switching between different wavelengths - Precision alignment with either split field microscope or video based targeting - Wedge Error Compensation (WEC) for optimal parallelism between substrate and mask - Optional Bond Alignment, UV-Nanoimprint Lithography capability

For more information on MA6 Mask Aligner for Pieces, Small Substrates and Wafers up to 150mm talk to Inseto (UK) Ltd