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Microelectronic Applications - DELO produce a variety of high purity materials for assembly processes including die attach, glob-top encapsulants, dam / fill materials, flip chip underfill materials, plus light activated and light cured adhesives for encapsulation, sealing and joining:
Die Attach Adhesives
Glob Top and Encapsulation
For more information on Microelectronic Applications talk to Inseto (UK) Ltd
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