Microelectronics Materials

Inseto's Microelectronics Materials Division provides assembly materials and machine consumable items for the semiconductor, photonic and hybrid assembly industries. Products include bonding wires and bonding ribbons, precision metal stampings, thermal dissipation materials, thick film materials, metalised thin film and precision machined ceramics, solder preforms, hermetic glass & ceramic sealed packages,, and die / wire bond assembly consumables including wedges, capillaries and collets, dicing blades etc.

For more information on Microelectronics Materials talk to Inseto (UK) Ltd