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![Multi-Layer Co-Fired Ceramic Packages](https://images.findtheneedle.co.uk/findtheneedle/products/3829253.jpg)
Multi-Layer Co-Fired Ceramic Packages - Single Chip and Multi Chip Substrates for low and medium volume applications. Capabilities include Pins, Seal-Frames & Packages as large as four inches square and between 2 and 30 layers of circuitry.
For more information on Multi-Layer Co-Fired Ceramic Packages talk to Inseto (UK) Ltd
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