Multi-Purpose Process Furnaces

For Semiconductor and advanced electronic production operations are fast ramping and cooling, space saving & energy efficient benchtop ovens with quartz process chambers, for temperatures ranging to 1250°C with devices up to 300mm diameter. Systems can have integrated IR heaters, acheive Vacuum down to 5 x 10-6 mbar/Torr, Oxygen <1ppm, have multiple process gases and a pure Hydrogen option. Applications uses include LPCVD, Expitaxy, Annealing, Diffusion, Wet/Dry Thermal Processes, HCI-Cleaning, Polyimide Curing, Alloying, Oxidation, low k Dielectrics, Wafer Bump Reflow, Fluxless Reflow Soldering, LTO, Thickfilm Paste & LTCC Sintering.

For more information on Multi-Purpose Process Furnaces talk to Inseto (UK) Ltd