Resin-bond Dicing Blades

- Resin as binder allows for blade wear management rendering - Excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic Substrates, HTCC and Glass - Resin Blade thickness varies from 3 mil to 100 mil (depending on diamond grit size)

For more information on Resin-bond Dicing Blades talk to Inseto (UK) Ltd