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![SRO Perfect Vacuum Soldering Systems](https://images.findtheneedle.co.uk/findtheneedle/products/3829356.jpg)
For Thermal Transfer Applications requiring processing under vacuum, or with process gases, including Void Free Solder Reflow, Package Lid Sealing, Annealing Die Attach & Substrate Bonding, Alloying, Flip Chip / Thermocompression Wafer Bonding, Flip Chip Bump Reflow, Popcorn Effect Analysing & other rapid thermal processes etc.
For more information on SRO Perfect Vacuum Soldering Systems talk to Inseto (UK) Ltd
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