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![Wedge Wire Bonding Equipment](https://images.findtheneedle.co.uk/findtheneedle/products/3304458.jpg)
The Orthodyne product range of wire bonding equipment includes inline wire bonders, semiautomatic bench-top wire bonders through to fully automatic stand-alone, for ultrasonic bonding both small and large wire diameters from 17 to 625microns for power electronic devices are available.
For more information on Wedge Wire Bonding Equipment talk to Inseto (UK) Ltd
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