IGBT Power Module Packaging Solutions

Here at Interplex, our application specific solutions suitable for the packaging of IGBT power modules and complete power stack assemblies utilizing a number of proven core high-force, high-power, pluggable interconnect technologies, including press-fit, IDC (Insulation Displacement Connectors), tuning forks and other products.

For more information on IGBT Power Module Packaging Solutions talk to Interplex Select Moulds Ltd