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KETEK's WB-Series SiPMs feature the latest advances in semiconductor and packaging technologies and offer leading-edge performance at attractive pricing.
WB-Series SiPMs are offered as 1x1mm² and 3x3mm² active area BGA surface mount components featuring a glass window and a "wrap-around" electrical contact design which significantly enhances the mechanical robustness of the WB-Series compared to other SMT SiPM designs. For convenience KETEK also supply the SMD component pre-mounted on a 2.54mm pitch 3-pin mini-PCB "Pin Adapter Board".
WB-Series SiPMs are offered as 1x1mm² and 3x3mm² active area BGA surface mount components featuring a glass window and a "wrap-around" electrical contact design which significantly enhances the mechanical robustness of the WB-Series compared to other SMT SiPM designs. For convenience KETEK also supply the SMD component pre-mounted on a 2.54mm pitch 3-pin mini-PCB "Pin Adapter Board".
For more information on SiPM Timing Characteristics talk to Prin & Lea
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