Hybrid Circuit Assembly

The facilities in the hybrid assembly clean area include: test; die bonding; wire bonding; burn-in; precision assembly; and environmental stress screening. Packaging is particularly important, to make sure that the product will meet the required environmental and performance specification. A range of different substrate types are used, including co-fired ceramic, thick film alumina, FR4 and more specialised materials.

For more information on Hybrid Circuit Assembly talk to PRP Optoelectronics Ltd